GEN3 Release Micro Webinar Episode 5, “Reliability Prediction in Electronics: Materials Testing — Printed Circuit Boards”


GEN3 Release Micro Webinar Episode 5, “Reliability Prediction in Electronics: Materials Testing — Printed Circuit Boards”

In this engaging 11-part micro-webinar series, subject matter experts Graham Naisbitt and Chris Hunt examine the history of the influences of electrochemical migration (ECM) and the evolution of the use of insulation resistance testing (SIR) which have been developed over the past 25 years by GEN3 and its association with the British National Physical Laboratory. GEN3 and NPL created the standard which has now been widely used around the world since the turn of the millennium.

The fifth episode, “Materials testing – Printed circuits, ‘ can be accessed in less than four minutes. Presenters share information on CAF and AMP, HV and LV design considerations, and other issues to consider.

Designed to complement the GEN3 book, The PCB Assembler’s Guide to … Process Validation, This entire webinar series can be viewed in about an hour and covers a full spectrum of topics surrounding the four groundbreaking testing standards released between 2019 and 2021 that set the stage for Objective Evidence and its widespread influence in the world of testing. electronics, whether in the high reliability field of space, medical, automotive or general industrial applications.

Visit Predicting reliability in electronics and start watching, for free, today!